22 research outputs found

    Exploring the development of school readiness in kindergarten in Norway : A case study of the implementation of the Gausdal Model

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    English abstract: Background: This research was initiated by a request from Gausdal municipality to have a master’s thesis written about the sensori-motoric project the Gausdal Model. One of the aims of the Gausdal Model is to better prepare children for school through a programme based on proportionate universalism. Aim: The aim was to explore key stakeholders understandings of school readiness and generate in-depth knowledge about their processes of implementation of the Gausdal Model. This could shed light on processes that develop children’s motor proficiency and its possible relation to school readiness. Methods: A case study of the implementation of the Gausdal Model was carried out in order to explore key stakeholders’ understanding of school readiness. The sample was strategic and the nine kindergarten teachers and parent informants were recruited from four municipal kindergartens in Gausdal. The health nurse connected to the programme was also an informant. Data were collected through qualitative interviews, partly informed by prior observations of the activities in the programme. The data analysis was inspired by principles from grounded theory as described by Charmaz (2014). The analysis aimed to identify components that could shed light on the processes that was studied. Bronfenbrenner’s ecological systems theory and Bandura’s social cognitive theory (SCT) and concept self-efficacy (SE), in particular were used as sensitising concepts in order to analyse the data and generate an understanding of how the Gausdal Model could develop children’s motor proficiency, and how this might be related to children’s school readiness. Results: The findings from the implementation of the Gausdal Model show that children’s motor proficiency can be understood as being developed through a process of socialisation where support through strong mesosystems and significant others, in this case kindergarten teachers and parents, could help develop the children’s mastery of their own bodies. At the mesosystem-level, quality and quantity of communication and aiming consistently towards the same goals was important. At the microsystem level, a combination of the four sources of SE and relational qualities between the kindergarten teachers and children seemed to develop children’s motoric SE and mastery of their own bodies. Motor proficiency seems to be related to school readiness through both the transferability of certain components of motoric SE as well as a social dimension, as social inclusion was an important component of school readiness. Hence, motor proficiency was related to a multidimensional understanding of school readiness. Conclusion: The Gausdal Model is in line with public health recommendations of early intervention and proportionate universalism, and has the potential to better prepare children for school as well as contributing to children’s socialization in general.Norsk sammendrag: Bakgrunn: Denne forskningen ble initiert av en forespørsel fra Gausdal kommune om å skrive en masteroppgave om det sanse-motoriske programmet Gausdalsmodellen. Et av målene for Gausdalsmodellen er å gi barn et bedre utgangspunkt for skolestart gjennom tiltak for alle – for å nå de få og styrke alle. Mål: Å utforske barnehagelærere, foreldre og helsesøsters forståelse av hva det vil si å være skoleforberedt og generere kunnskap om gjennomføringen av Gausdalsmodellen. Dette kan belyse prosesser som utvikler barnas motoriske ferdigheter, samt en mulig sammenheng mellom dette og det å være skoleforberedt. Metoder: En kasus-studie av gjennomføringen av Gausdalsmodellen og barnehagelærere, foreldre og helsesøsters forståelse av hva det vil si å være skoleforberedt. Utvalget er strategisk og ni informanter (barnehageansatte og foreldre) ble rekruttert fra fire kommunale barnehager i Gausdal. En helsesøster som arbeider med Gausdalsmodellen er også informant. Data ble samlet inn gjennom kvalitative intervjuer som blant annet ble utarbeidet på bakgrunn av observasjoner av aktiviteter i Gausdalsmodellen. Analysen av datamaterialet er inspirert av prinsipper fra grounded theory beskrevet av Charmaz (2014). Analysen tar sikte på å identifisere komponenter som kan kaste lys over de prosessene som ble studert. Bronfenbrenners utviklingsøkologiske modell og Banduras sosial kognitive teori og konseptet mestringsforventning, ble brukt for å for analysere datamaterialet og forstå hvordan gjennomføringen av Gausdalsmodellen kan utvikle barnas motoriske ferdigheter, samt hvordan disse ferdighetene kan knyttes til det å være skoleforberedt. Resultater: Funnene viser at barns motoriske ferdigheter kan forstås som å bli utviklet i en sosialiseringsprosess der støtte fra sterke mesosystemer og signifikante andre, i dette tilfellet barnehagelærere og foreldre, er av betydning. På mesosystem-nivå gjennom kvantitet og kvalitet på kommunikasjon og en felles målsetning rundt barnets utvikling. På mikronivå synes en kombinasjon av relasjonelle kvaliteter mellom barnehagelærerne og barna, og kilder til utvikling av barnas mestringsforventning, å bidra til barnas motoriske utvikling og kroppslige mestring. Motoriske ferdigheter synes å være knyttet til det å være skoleforberedt, både gjennom overførbarhet av visse komponenter av motorisk mestringsforventning, samt gjennom en sosial dimensjon hvor sosial inkludering var viktig for at barna skal være skoleforberedt. Derfor er motoriske ferdigheter knyttet til en helhetlig forståelse av hva det vil si å være skoleforberedt. Konklusjon: Gausdalsmodellen er i tråd med folkehelseanbefalinger om tidlig intervensjon og proposjonell universalisme og har potensiale til å forberede barna til skolestart i tillegg til å bidra i en generell sosialiseringsprosess

    Al-Al thermocompression bonding for wafer-level MEMS sealing

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    Al–Al thermocompression bonding has been studied using test structures relevant for wafer level sealing of MEMS devices. Si wafers with protruding frame structures were bonded to planar Si wafers, both covered with a sputtered Al film of 1 μm thickness. The varied bonding process variables were the bonding temperature (400, 450 and 550 °C) and the bonding force (18, 36 and 60 kN). Frame widths 100 μm, 200 μm, with rounded or sharp frame corners were used. After bonding, laminates were diced into single chips and pull tested. The effect of process and design parameters was studied systematically with respect to dicing yield, bond strength and resulting fractured surfaces. The test structures showed an average strength of 20–50 MPa for bonding at or above 450 °C for all three bonding forces or bonding at 400 °C with 60 kN bond force. The current study indicates that strong AlAl thermocompression bonds can be achieved either at or above 450 °C bonding temperature for low (18 kN) and medium (36 kN) bond force or by high bond force (60 kN) at 400 °C. The results show that an increased bond force is required to compensate for a reduced bonding temperature for AlAl thermocompression bonding in the studied temperature regimeacceptedVersio

    Impact of SiO2 on Al–Al thermocompression wafer bonding

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    Al–Al thermocompression bonding suitable for wafer level sealing of MEMS devices has been investigated. This paper presents a comparison of thermocompression bonding of Al films deposited on Si with and without a thermal oxide (SiO2 film). Laminates of diameter 150 mm containing device sealing frames of width 200 µm were realized. The wafers were bonded by applying a bond force of 36 or 60 kN at bonding temperatures ranging from 300–550 °C for bonding times of 15, 30 or 60 min. The effects of these process variations on the quality of the bonded laminates have been studied. The bond quality was estimated by measurements of dicing yield, tensile strength, amount of cohesive fracture in Si and interfacial characterization. The mean bond strength of the tested structures ranged from 18–61 MPa. The laminates with an SiO2 film had higher dicing yield and bond strength than the laminates without SiO2 for a 400 °C bonding temperature. The bond strength increased with increasing bonding temperature and bond force. The laminates bonded for 30 and 60 min at 400 °C and 60 kN had similar bond strength and amount of cohesive fracture in the bulk silicon, while the laminates bonded for 15 min had significantly lower bond strength and amount of cohesive fracture in the bulk silicon.acceptedVersio

    Environmental Stress Testing of Wafer-Level Al-Al Thermocompression Bonds: Strength and Hermeticity

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    Hermeticity, reliability and strength of Al-Al thermocompression bonds realized by applying different bonding parameters have been investigated. Laminates of diameter 150 mm were realized by bonding wafers containing membrane structures to wafers with patterned bonding frames. The laminates were bonded applying a bond force of 36 or 60 kN at temperatures ranging from 300 to 400°C for 15, 30 or 60 minutes. The hermetic properties were estimated by membrane deflection measurements with white-light interferometry after bonding. Reliability was tested by exposing the laminates to a steady-state life test, a thermal shock test, and a moisture resistance test. Bond strength was measured by shear test and pull tests. Laminates bonded applying a bond force of 60 kN at temperatures of 350 or 400°C resulted in hermetic bonds. No significant change in membrane deflection was observed after the steady-state life test or the thermal shock test. However, a gross leakage was observed in 1–11% of the dies after exposure to the moisture resistance test. The maximum leakage rate (MLR) estimated from membrane deflection measurements was below 10−11 mbar·l·s−1 for all laminates. The measured average bond strength of dies from selected laminates ranged from 28 to 190 MPa.acceptedVersio

    Al-Al Wafer-Level Thermocompression Bonding applied for MEMS

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    Wafer-level thermocompression bonding (TCB) using aluminum (Al) is presented as a hermetic sealing method for MEMS. The process is a CMOS compatible alternative to TCB using metals like gold (Au) and copper (Cu), which are problematic with respect to cross contamination in labs. Au and Cu are commonly used for TCB and the oxidation of these metals is limited (Au) or easily controlled (Cu). However, despite Al oxidation, our experimental results and theoretical considerations show that TCB using Al is feasible even at temperatures down to 300−350 °C using a commercial bonder without in-situ surface treatment capability.acceptedVersio

    Texture of Al films for wafer-level thermocompression bonding

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    Properties of aluminum thin films for thermocompression bonding have been studied in terms of surface roughness, grain size, and grain orientation by AFM, SEM, XRD and EBSD for thermocompression bonding. Al films were sputter deposited directly on Si and thermally oxidized Si wafers, respectively. The resulting Si/Al and Si/SiO2/Al sample types were compared after annealing (300–550 °C) in vacuum. The Si/SiO2/Al film samples showed higher surface roughness than the Si/Al samples. The as-deposited films had (111) preferred orientation, while (100) and (110) oriented Al grains were also present in Si/SiO2/Al samples. The Si/SiO2/Al samples and Si/Al sample annealed at 550 °C had a conical texture. The observed evolution of the grain structure with annealing temperature is discussed in terms of native oxide, surface roughness, diffusivity and grain orientation dependent mechanical properties in order to shine light on previously observed differences in Alsingle bondAl thermocompression wafer-level bonding with Si/SiO2/Al and Si/Al wafers.acceptedVersio

    Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity

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    Hermeticity, reliability and strength of four laminates bonded at different temperatures by Au-Au thermocompression bonding have been investigated. Laminates with a diameter of 150 mm were realized by bonding a wafer containing membrane structures to a Si wafer with patterned bond frames. A bond tool pressure of 2266 mbar was applied for 15 minutes at temperatures ranging from 150–300°C. The hermetic properties were estimated by membrane deflection measurements applying white-light interferometry after bonding. Reliability was tested by exposing the laminates to a steady-state life test, a thermal shock test, and a moisture resistance test. Bond strength was estimated by pull test measurements. A dicing yield above 90% was obtained for all laminates. Laminates bonded at 200°C and above had significantly higher hermetic yield than the laminate bonded at 150°C. No degradation in hermeticity was observed after the reliability tests. The maximum leakage rate (MLR) was estimated from two measurements of membrane deflection executed at two different times and was below 10−11 mbar ⋅ l ⋅ s−1. The average bond strength ranged from 44 to 175 MPa
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